Idea-to-Silicon-SoCs for Artificial Intelligence

 

OpenFive’s  Idea-to-Silicon capabilities combined with our advanced design methodologies on leading-edge 5nm, 7nm and 12nm foundry processes, and 2.5D packaging technology enable exciting new designs applications such as Artificial Intelligence (AI), Edge computing, Networking, and High-Performance Computing (HPC). OpenFive’s flexible business model lets us engage with you at multiple entry points in the design. Design expertise for building scalable, customized SoCs with in-house design, integration, and advanced verification using automated tools and methodology.

OpenFive, an Alphawave IP company — your proven path from custom SoC architecture to volume silicon. OpenFive offers end-to-end expertise in Architecture, IP Integration, Design Implementation, Software, Silicon Validation, and Manufacturing to deliver high-quality silicon in advanced nodes down to 5nm.

With spec-to-silicon design capabilities, customizable platforms, and differentiated IP for SoCs for Artificial Intelligence, Datacenter/High Performance Computing, Networking, and Storage applications, OpenFive is uniquely positioned to deliver highly competitive domain specific processor agnostic SoCs customized for your application.

 OpenFive is a long-standing member of TSMC’s Value Chain Aggregator (VCA) program.

OpenFive provides a complete solution from package selection through design and development, to high-volume manufacturing. We understand the importance of selecting the proper packaging solution to meet the technical and cost constraints of each design. Our packaging capabilities include 2.5D technology, and OpenFive’s extensive experience enables us to meet the unique needs of each customer and successfully launch their product.

2.5D IC is a packaging technology where multiple die are placed face down and side by side on a silicon or organic interposer. The active surface of the die has micro-bumps that connect to pads on the surface of the silicon interposer. Connections from these pads directly connect to TSVs (Through Silicon Vias), which pass through the interposer substrate and connect to the package substrate. The connections from the pads can also be connected through interposer routing to other TSVs that are in-turn connected to pads and micro-bumps of other die on the interposer. 2.5D IC technology helps reduce interconnection length between multiple dies assembled on the interposer, leading to lower power consumption and lower latency as well as an increase in the number of interconnection routes on the interposer, which results in increased bandwidth compared to traditional 2D off-chip interconnections.

The picture above shows mounting 2 or more silicon dies onto an interposer die and then assembling the whole system into a single package.

Silicon based on 2.5D technology is making inroads into high performance computing, graphic processors, and AI (Artificial Intelligence) processors utilizing High Bandwidth Memories (HBM). These HBMs are available as tested KGDs (Known Good Die), and are mounted on the interposer along with die containing the main processor and HBM controller. High density routing through the interposer interconnects the two die.

The main advantages of this technology are miniaturization, enhanced performance, lower latency, increased bandwidth and power efficiency. Key advantage of 2.5D technology is that the die that are mounted on interposer need not utilize the same process node or technology. This helps in using die manufactured in various technology nodes. As an example, a HBM 3D stacked memory die can be mounted on the interposer with a processor die manufactured in 7nm process technology.

Open-Silicon Inc., an Alphawave IP company, is the legal entity operating under the OpenFive brand whose Scope of ISO 9001:2015 Certification is, “Design, Manufacture, and Sales of ASICs utilizing subcontracted Wafer, Fabrication, Assembly and Test Services.”